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		<title>Zoned on The Warm IR Heating Factory</title>
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				<title>Zoned heating for advanced wafer fab</title>
				<link>http://warm-ir-factory.com/en/posts/zoned-heating-for-advanced-wafer-fab/</link>
				<pubDate>Wed, 17 Jun 2026 11:48:03 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://warm-ir-factory.com/images/eeeb9669114c0c0a0b2bef3f902d01a9.png&#34; alt=&#34;Zoned heating for advanced wafer fab&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;On the lithography floor, temperature isn’t just another parameter—it &lt;em&gt;is&lt;/em&gt; the process. A 2°C swing during soft bake spreads photoresist thickness, and a hard bake that drifts even a little will push critical dimension control right out of spec. Wafers keep moving, ovens never stop, and the thermal budget has zero patience.&lt;/p&gt;&#xA;&lt;h2 id=&#34;what-matters-under-the-hood&#34;&gt;What &lt;a href=&#34;https://o-yate.net&#34;&gt;matters&lt;/a&gt; under the hood&lt;/h2&gt;&#xA;&lt;p&gt;We built zoned heating around independent thermal segments, each tightly regulated. The point is to hit hotspots and fix edge roll-off without overshooting the bulk of the wafer. Short-wave halogen elements give you fast response, and closed-loop control keeps wafer-level &lt;a href=&#34;https://henruite.com&#34;&gt;uniformity&lt;/a&gt; at ±0.1°C across the full bake profile.&#xA;The system runs in Class 1–100 cleanrooms and is built to avoid adding particles: low-outgassing materials, sealed quartz/ceramic interfaces, and laminar airflow routing keep particle counts flat even during long bakes. Repeatability is the whole game—every soft bake and hard bake lands on the same thermal curve, shift after shift.&lt;/p&gt;</description>
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